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preliminary data this is preliminary information on a new product now in development or undergoing evaluation. details are subject to change without notice. november 2007 rev 1 1/13 13 SPBT2563C1 bluetooth? class 1 module features bluetooth tm specification compliant v2.0 output power class 1 ( 20 dbm max) transmission rate up to 721 kbps in br point-to-point, point-to-multi-point (up to 7 slaves) and scatternet capability asynchronous connection oriented (acl) logical transport link synchronous connection oriented link: 2 simultaneous sco c hannels capability pitch-period error concealment (ppec) improves speech quality in the vicinity of interference like e.g. wlan extended sco (esco) links packet types supported: ? acl: dm1, dm3, dm5, dh1, dh3, dh5 ? sco: hv1, hv3 and dv ? esco: ev3, ev4, ev5 adaptive frequency hopping (afh): hopping kernel, channel assessment as master and as slave efficient and flexible support for wlan coexistence in collocated scenario communication interfaces: ? fast uart up to 4 mbit/s ? spi interface ? pcm interface memory organization: ? on chip ram, including provision for patches ? on chip rom, preloaded with fw up to hci 3.3 v single supply voltage no external oscillator required integrated voltage regulator with inhibit function. module size: 17 x 29 mm order code SPBT2563C1 description SPBT2563C1, class 1 radio module is highly integrated for easy implementation in embedded applications. class 1 module enables wireless communication with other bluetooth enabled devices up to 100 m away. the SPBT2563C1 integrates on a unique fr4 pcb support: bt 2.0 radio, 32.768 khz and 26 mhz oscillators, vreg as well as pa function. the antenna has not been included in order to grant a degree of freedom to the user in selecting the most suitable design and placement between external and integrated antenna that could be sma aerial or a low cost antenna trace designed on pcb. the module is based on the st bluetooth transceiver stlc2500c and can be interfaced by the host processor by means of a uart or spi line (selectable by a pin) for hci transport, and pcm for voice. SPBT2563C1 module implements an add-on feature perfectly fitting in systems equipped with host processor capable to manage upper and lower bluetooth stack layers, including profiles. st bluetooth spbt2563 series is specifically targeting all those applications requiring bluetooth devices integrating up to hci level. conformance testing through bluetooth qualification program e nables a fast time to market after system integration, by ensuring a high degree of complianc e and interoperability. www.st.com
contents SPBT2563C1 2/13 contents 1 certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 rohs compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.2 operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 dc i/o specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 bluetooth section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8.1 low-power improvements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8.2 low power clock startup time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8.3 pcb layout of the antenna output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 9 ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
SPBT2563C1 certifications 3/13 1 certifications bqb qualified component, listed as stlc2563: bqb id b012391 1.1 rohs compliance st modules are rohs complaint and being based on st devices comply with ecopack? norms implemented by st.
block diagram SPBT2563C1 4/13 2 block diagram figure 1. block diagram stlc2500 32.768 xtal 26 mhz oscillator pa supply voltage regulator pcm uart/ spi 32.768 khz reset uart/spi sel vcc inhibit ant sw ant c
SPBT2563C1 maximum ratings 5/13 3 maximum ratings 3.1 absolute maximum ratings 3.2 operating ranges operating ranges define the limits for functional operation and parametrics characteristics of the module. functionality outside thes e limits is not implied table 1. absolute maximum ratings symbol parameter values unit min max v cc module supply voltage 4 v v in input voltage on any digital pin vss - 0.3 vcc + 0.3 v t stg storage temperature -40 +85 c h humidity (not condensing) 0 95 % t sold soldering temperature < 10s 250 c table 2. operating ranges symbol parameter conditions values unit min typ max v cc module supply voltage -20c < t < 70c 3.1 3.3 3.6 v t stg operating ambient temperature -20 +70 c i txbr total supply current in tx br basic rate, dh1 173kbps (master/slave) 46 ma i rx total supply current in rx br basic rate, dh1 173kbps (master/slave) 33 ma idisable module disabled current. enable = l 1 a
dc i/o specification SPBT2563C1 6/13 4 dc i/o specification (v dd = 3.3v, t = 25c, unless otherwise specified) table 3. dc input / output specification symbol parameter conditions values unit min typ max vil low level input voltage 1.1 v vih high level input voltage 2.15 2.85 v vol low level output voltage 0.15 v voh high level output voltage 2.55 v lp_ckh 32.768khz out high level output voltage 2.4 v lp_ckl 32.768khz out low level output voltage 0.3 v inh_l inhibit signal low level 0.15 v inh_h inhibit signal high level 2 vcc v iinh inhibit input current vinh = 3.3v 38 55 a
SPBT2563C1 bluetooth section 7/13 5 bluetooth section t a = 25 c, v cc = 3.3 v (parameters are given at antenna pin) note: details about bluetooth features are available at www.st.com , out of the stlc2500c data sheet. table 4. bluetooth parameters symbol parameter conditions values unit min typ max p out-br output power basic rate +16.5 18 dbm rx sensbr sensitivity basic rate, clean tx -82 dbm rx max max useable input level 10 dbm freq frequency range 2402 2480 mhz ?f initial cf tolerance -75 +75 khz | ? f-p1| cfd 1 slot packet 15 25 khz | ? f-p3| cfd 3 slot packet 15 40 khz | ? f-p5| cfd 5 slot packet 15 40 khz | ? f/50us| cfd rate 20 khz/ s hop hopping 1600 hops/ sec sys_ck system clock 26 mhz system clock precision 25 c -10 +10 ppm system clock stability -20 c to 70c -20 +20 ppm lp_ck low power clock 32.768 khz low power clock accuracy -200 +200 ppm z antenna port impedance tx and rx 50 ?
pin settings SPBT2563C1 8/13 6 pin settings table 5. pin description pin n name i/o description power / gnd/enable 12 vcc - dc power input 3.3 0.3 v 2gnd- 11 gnd - 3 inhibit i module inhibit pin , active low. to be connected to v cc for module enabling ; if left open or connected to gnd the module is disabled uart / spi interface / selection 8 txd o uart serial data output / spi data out 5 rxd i uart serial data input / spi data in 7 cts i uart clear to send / spi ck 6 rts o uart request to send / spi csn 17 uart / spi i uart / spi selection when connected to vcc uart is selected when connected to gnd or left open , spi is selected pcm interface 15 pcmin i pcm data in 14 pcmout o pcm data output (tri-state capability) 13 pcmsync i pcm sync signal 16 pcmbclk i pcm bit clock rf interface 1 ant i/o antenna interface, 50 ? impedance g1 ant_gnd - antenna ground g2 ant_gnd - antenna ground system control and clock interface 4 reset_n i reset ( active low ) 9 bt_wakeup i wake-up signal to bluetooth 10 host_wakeup o wake-up signal to host 18 nc1 spare signal (pin g7 of stlc2500c) 19 lp_ck_out o lp clock out the 32.768 khz low power clock is available at this pin wlan/bt coexistence 20 bt_priority o wlan/bt coexistence function 21 wl_active i wlan/bt coexistence function 22 rf req1 o pin e6 of stlc2500c
SPBT2563C1 mechanical dimensions 9/13 7 mechanical dimensions in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect . the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com figure 2. mechanical dimensions
application SPBT2563C1 10/13 8 application 8.1 low-power improvements in low power modes,due to the oscillators continuously runnig, the module current is roughly 2.5 ma ( measured at pin 12). this current consumption can be drastically im proved by switching off the two oscillators during low power phases. this can be done by means of inhibit function (pin 3) which act directly on the internal power supply regulator ; in this mode the module is no more powered and the current consumption becomes < 1 a instead of 2.5ma. 8.2 low power clock startup time due to 32.768 khz oscillator stabilization , when the module is powered on or when enabled ( inhibit from low to high state) a waiting time of at least 500ms must be observed ( reset signal could be kept low for the waiting1 time or given after it). 8.3 pcb layout of the antenna output the microstrip track connected to the antenna (pin 1) should respect a characteristic impedance of 50 ? . it should be verified particularly if some variations in the final project: dielectric material, tolerances, layout changes. the rf ground island around the antenna is connected only to g1 and g2 pins of the module. this ground island is isolated from other grounds. the ground plane at lower pcb layer should also be isolated from other grounds. vias every 5 millimeters should connect toge ther rf ground islands of each layer. figure 3. layout of the rf track to antenna pin of SPBT2563C1 1 g1 g2 2 3 4 isolated rf gnd connected to g1 and g2 1 g1 g2 2 3 4 isolated rf gnd connected to g1 and g2
SPBT2563C1 ordering information scheme 11/13 9 ordering information scheme table 6. ordering information scheme spbt 2563 c1 bluetooth modules v 2.0 compliant class 1
revision history SPBT2563C1 12/13 10 revision history table 7. document revision history date revision changes 14-nov-2007 1 first release
SPBT2563C1 13/13 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2007 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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